Instant plasma generator

Gain microsecond-level control of the RF source waveform with the instant plasma generator.

Prodrive Technologies introduces solid-state technology that replaces mechanical matchboxes challenged by varying plasma load conditions.

The instant plasma generator expands control over plasma conditions for atomic-scale plasma etch and deposition processing. It supports wafer ignition and stabilization through high-speed pulsing and near-arbitrary envelope control while maintaining accurate power delivery.

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Prodrive Technologies introduces solid-state technology that replaces mechanical matchboxes challenged by varying plasma load conditions.

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Single box solution

Single box solution instead of multiple subsystems.
No matchbox required

Eliminates use of slow and unprecise matchboxes.
No frequency tuning required

Saves installation, setup and matching time.
High efficiency

Achieve elimination of system losses by making matchboxes and cables obsolete.
Microsecond-level output power settling

Control the plasma near real-time, microseconds.
Advanced control mechanism

The generator control is optimized for use with plasma loads.

Features

Microsecond-level waveform control
Integrated IV sensor
Dynamic high speed (multi-level) pulsing
Multiple control modes
Programmable (locked) phase
Common exciter synchronization (CEX)
EtherCAT
DC-bias measurement support
Arc management support

Benefits

Improved process control

Microsecond-level control ensures that processes run stable and provide optimal diagnostics.
Reduced system complexity

Remove matchboxes, matchbox controllers and other external sensors by using a single box solution.
Reduce process drift

Reduce process drift with very fast and stable RF generation with integrated sensors.
Enhanced system effiency

By optimized the effiency with fewer inbetween components, the system efficiency is enhanced.